Walmark Problem Analysis Form


To insure the most accurate response please fill out as much information as possible.

Contact Name:
E-Mail:
Company:
Street Address:
City, State, Zip: ,
Phone:
Machinery/Application Method
A. Machine manufacturer and model number:
B. Application Method: If Other:
C. Application (i.e., case seal, wood assembly):
D. Current operating speed: units/minute
E. Desired operating speed: units/minute
F. Compression cycle: seconds
G. Compression pressure:
H. Type of adhesive being used:
I. Pot temperature:
(if hot melt)
oF
J. Current adhesive supplier:
K. Product name/number:
Substrate(s)
A. What is being bonded?
B. With:
C. Are either of the substrates coated?
(yes,no)

D. What type of coating?
E. Other pertinent characteristics of the substrate:
End Use Requirement
A. Indicate continuous or intermittent:
B. Temperature extremes: HighoF, LowoF
C. Bond strength needed:
D. Resistance to: If Other:
E. Other standards:
(specific test and limits)

Cost
A. Current price:per(pound, gallon, drum, pail)
B. Container size:
C. Units bonded per container:
D. Monthly volume:
E. Purchase frequency:
F. Adhesive manufacturing location:
G. Shipping charges/FOB points:
Plant Conditions
A. Ambient temperature:oF, Summer.oF, Winter.
B. Humidity:
C. General conditions:
(clean, dusty, wet, dry)

D. Other relevant factors: